Global Data Reports

Shinkawa Ltd. (6274) - Financial and Strategic SWOT Analysis Review

Monday, Jul 11, 2016

Shinkawa Ltd. (Shinkawa) is a technology company that designs and develops semiconductor equipment for bonding processes. The company’s products icnlude wire bonder, die bonder, COF bonder, flip chip bonder, bump bonder, discrete assemblers and package sorter. It provides sales and after sales service of semiconductor manufacturing equipment. Shinkawa offers technological platforms which are suitable for the applications in computers, TV, cameras and cars. The company operates through its subsidiaries in China, Malaysia, the Philippines, Republic of Korea, Singapore, Taiwan, Thailand, Vietnam and the US. The company is headquartered in Musashimurayama-shi, Japan.

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