Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an order for its latest-generation ABTS-P Burn-in and Test System from a new customer, a leading mobile wireless communications chipset company in China. The system is expected to ship within Aehr Test's current fiscal first quarter.
Gayn Erickson, President and CEO of Aehr Test Systems, said, "This initial order from another new customer in China continues our expansion and success in the growing China market. This is the ninth new customer in China that has selected our advanced ABTS burn-in and test platform to perform high-temperature operating life (HTOL) tests to qualify their devices for production and for their customers. As China accelerates its growth in semiconductor manufacturing and increases production infrastructure and testing capacity, we see significant opportunities for continued expansion in this growing market with our innovative burn-in and test systems. Aehr Test's investment in direct applications and service support in China make the ABTS solution stand out from competitive products."
"This rapidly-growing fabless manufacturer of mobile chipset platforms for smartphones and other consumer electronics products was previously using Aehr Test's ABTS-L Burn-in and Test System at a test house in China," commented Mark Allison, vice president of sales at Aehr Test. "We believe that the quality of the system and the positive results they achieved with it were major factors in choosing our latest generation ABTS-P system for their new lab. They selected the ABTS-P system because of its per-pin resources, its ability to test high pin count devices with its 256 channel configuration, and the significant installed base of ABTS systems in mainland China and Taiwan."
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability in which the devices are subjected to temperatures as high as 150C for extended periods of time. In typical HTOL reliability tests, failure mechanisms are accelerated by burning-in the devices for 1,000 hours to confirm that the basic design and fabrication process of a device will meet the reliability targets over an extended period of normal use.
The Aehr Test ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications. ABTS systems can be configured with up to 72 burn-in boards, up to 320 I/O channels, 32M of test vector memory per channel and up to 16 independent device power supplies. The ABTS system is optimized for use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for up to 64 devices per burn-in board and up to 75 watts per device or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime.
*iSocket is a trademark of Sensata Technologies, Inc.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic and memory integrated circuits and has an installed base of more than 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, capacity needs and opportunities for Aehr Test products in package and wafer level test. Aehr Test has developed and introduced several innovative products, including the ABTS and FOXTM families of test and burn-in systems and the DiePak® carrier. The ABTS system is used in production and qualification testing of packaged parts for both low-power and high-power logic as well as all common types of memory devices. The FOX system is a full wafer contact test and burn-in system used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. The DiePak carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of bare die. For more information, please visit Aehr Test's website at www.aehr.com.